Profile updated as of 8th December 2019

AMD Ryzen 7 3700X

Yay! Here is the profile I made for my Ryzen 7 3700X. The successor to my trusty Ryzen 7 2700X, well, sort of.

Without further ado, the profile!

Silicon Die shot Image credit to Fritzchen Fritz, you can see his awesome work here.

Gallery

(Above) Reverse of the AM4 CPU package (uPGA 1331).

(Above) The silicon die shot for the Ryzen 7 3700X. "Matisse" processors have at least two distinct components: Visible here is the larger "I/O Die" on the left, built on Global Foundries 12nmLP, and at the top right you can see the "CCD" or "Compute Die" that contains the processor cores and their caches, built on TSMC 7nm (N7) with DUV. Below that, is the pinout for a second Compute Die chiplet, which is present on the processors with more than 8 cores (up to 16). (Note this image is actually a Ryzen 5 3600, but they would be indistinguishable, as the only changes to the Ryzen 5 3600 are two disabled cores, laser cuts are invisible on die shots, and lower clock speeds).

(Right) The silicon die shot of the Zen2 Compute Die (CCD). The Ryzen 7  3700X has all of these cores enabled on the single CCD. The large blue tiles in the centre are the L3 cache, 4MiB of L3 on this die is about the same size as a Zen2 core.

CPU Information

Brand Name: AMD Ryzen 7 3700X 8-core Processor

Manufacturer: Advanced Micro Devices

Release Date: July 7th 2019

MSRP: $329 USD

Codename: Matisse

CPU Implementation: Full Chip * with one Compute Die

CPU Type: semi-SoC

Architecture: Zen 2

Lithography Process: TSMC 7nm N7 FinFET (CCD), Global Foundries 12nmLP FinFET (I/OD)

Socket: AM4 (PGA 1331)

Approximate die size: ~75mm² (CCD), ~125mm² (I/OD)

SashleyCat's CPU die Size Rating: Tiny (CCD), Small (I/OD)

Approximate Transistor Count: 3,900 Million (CCD), 2,090 Million (I/OD)

Approximate Transistor Density: ~52 million/mm² (CCD) ~16.7 million/mm² (I/OD)

 

CPU Features

Simultaneous Multi-Threading: Yes (2-way)

Superscalar: Yes

Out of Order Execution: Yes

Branch Prediction: Hashed Perceptron-based and TAGE

Address Space: 64-bit

Integrated Graphics: No

On-die USB/SATA: Yes (4 x USB 3.1 + 4 x SATA3)

On-die Network/Modem: No

PCI-E Lanes: 24 Gen4 (16x/2x8x GPU*, 4x NVME, 4x CPU/Chipset Communication) (28 Full Chip)

Interconnect: 512-bit (64 byte per clock) Infinity Fabric 2 between CCD and I/OD, IMC. (256-bit (32 byte per clock) connection to L1/2/3 caches).

Unlocked for Manual Overclocking: Yes

Turbo Boost: Yes

Automatic Overclocking: Yes (XFR2/PBO)

Instruction Set Architecture: x86

Additional Instructions (potentially non-exhaustive):

SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD-V, AES, AVX, AVX2, FMA3, SHA, F16C, BMI, BMI1, BMI2, MMX+

CPU Computing Resources

Processor Cores: 8

Independant Processor Cores: 8

Logical Threads: 16

Core Topology: 2 x 4-core Complex

Level 4 Cache: N/A

Level 3 Cache: 2 x 16384 KB

Level 2 Cache: 8 x 512 KB

Level 1 Instruction Cache: 8 x 32 KB

Level 1 Data Cache: 8 x 32 KB

Core Op Cache: 4096 entry

Core Integer Register size: 180 entry

Core Integer Reorder buffer size: 224 entry

Core Execution Width: 11

Core Seperated INT/FP Engines: Yes

Core Integer Execution Units: 4 ALU, 3 AGU

Core Floating Point/SIMD Execution Units: 2 x 256-bit MUL, 2x 256-bit ADD

CPU Memory Subsystem

Main Memory Type: DDR4

Maximum Main Memory: 128 GB *

Main Memory Composition: dual-channel (2 x 64-bit)

Main Memory Supported Frequency/Data Rate: 1600 MHz / 3200 MHz (PC4-25600)

Main Memory Peak Memory Bandwidth: 51.2 GB/s

 

CPU Frequency and Peak performance

Core Base Clock Speed: 3600 MHz

Core Peak Turbo Speed: 4400 MHz *

Interconnect Clock Speed: 1600 MHz (1:1 DRAM, 1:2 DRAM selectable in bios)

CPU SIMD Computing Power FP16: -- *

CPU SIMD Computing Power FP32: -- *

CPU SIMD Computing Power FP64: -- *

 

CPU Thermal and Power

Standard Cooling Solution: "Wraith Prism" top-down cooler with heatpipes

Thermal Design Power: 65 W

Typical Maximum Socket Power: 88 W

Maximum Allowed Junction Temperature (TJ Max): 95*C

Normal Peak Voltage Range: 1200 -1500 mV *

 

 

CPU description

The Ryzen 7 3700X launched on July 7th, 2019. This is a special date as it is the 7th day of the 7th month, it commemorates the industry's first "7nm" technology-based Central Processing Unit. It is also among the first desktop consumer CPUs to support PCI-express 4.0. The Ryzen 7 3700X represents lower tier "high-end" product of the Ryzen 7 lineup, offering 8 cores and 16 threads and slightly higher peak clock speeds (but 100 MHz lower base frequency) than its predessor, the 2700X, at the same price. Like all "3rd generation" Ryzen processors, the Ryzen 7 3700X uses the new "Zen2" architecture, which utilises a new chiplet design whereby the I/O logic is on a seperate physical silicon die from the Processor cores and their caches. This allows AMD to prioritise the more expensive 7nm process node to the areas of the processor that will benefit the most from the lower power characteristics and high density, such as the cores themselves and the large L3 cache.

Major changes to the Zen2 architecture include a doubled-width SIMD in the Floating Point Unit, which is now 256-bits wide but retains the same design with two addition and two multiplication pipes, but they are now able to work with twice the numbers in a single operation, effectively doubling the floating point performance of the processor per clock per core, this also means AVX2 (256-bit) is now supported natively, without having to break into two smaller 128-bit micro ops. Certain FPU operations also operate at reduced latency versus the Zen1 architecture. In addition, the Integer execution engine features a wider register file and reorder buffer, and an additional Address Generation Unit.

Major changes to Zen2's frontend have been made. The Core now features a reworked frontend with a new TAGE-based branch predictor on top of the existing Hashed-perceptron method used on 1st and 2nd generation Ryzen processors. The Micro-op cache has been doubled to 4096 entries, allowing better utilisation of SMT amongst other things. The L3 cache has been increased per CCX to 16MB, giving each CCD Chiplet a huge 32MB of on-die fast L3 Cache. This mitigates the latency penalty of using a seperate I/O die for the memory controller.

Making use of the (as of 2019) cutting edge 7nm process technology from TSMC for the Compute Die, the Ryzen 7 3700X like all other 3rd generation Ryzen processors, has excellent performance per watt. This represents the first time in nearly 20 years AMD has a process technology advantage over their competitor Intel, in desktop CPUs.


 

CPU approximate Performance

Sashleycat CPU Performance Rating: (2019): Fantastic for high-refresh gaming, streaming, mega-tasking and image editing

Ryzen 7 3700X provides high performance in all applications, thanks to industry-leading (as of 2019) "IPC" Throughput, clock speeds north of 4 GHz and 8 physical cores with SMT enabled, for 16 threads. For the first time in nearly 2 decades, AMD has the IPC advantage on desktop processors, this means the Ryzen 7 3700X like all other 3rd generation Ryzen CPUs gets more work done per clock cycle than previous generations, and Intel's Skylake-based CPUs (Currently their entire desktop and server lineup). Performance per clock is around 10-15% higher than the previous generation "Zen+" and about 5-6% higher than Intel's "Skylake". The Processor operates at clock speeds up to 4.4 GHz on a couple of cores in light workloads, and around 4.0 to 4.2 GHz on all cores depending on the workload. Typically it is operating at 4.1 in most 16-thread loads. With 8 high performance cores with industry leading IPC, 2-way SMT, and a 65W Thermal Design Powrer (88W Peak socket power) the 3700X offers unprecidented performance for the wattage and allows highly efficient high-refresh gaming, media-editing, mega-tasking and professional applications, beating the more expensive i7-9700K in everything except ultra high refresh gaming, but the difference is marginal, around 10% at most.

The "Zen2" Architecture improves gaming performance dramatically over previous generation processors. While even the 2nd generation "Zen+" CPUs are fantastic for gaming, the 3rd generation "Zen2" CPUs are almost on par with Intel's "Skylake" in average FPS in high refresh, even with a large clock deficit. In some games they even beat their Intel competition.

 

Notes

Full Chip

Ryzen 7 3700X uses a single, fully enabled Compute Die with all of its processing resources enabled, the I/OD is also fully featured as far as I am aware, however the AM4 package for Matisse supports am aximum of two Compute dies and up to 16 cores and 64MB of L3 cache. The second Compute Die chiplet is physically not present on the Ryzen 7 3700X.

CPU SIMD Computing Power

I am verifying this.

PCI-E Lanes

Ryzen 7 3700X requires an "X" series Chipset Motherboard to support PCI-E 16x -> 2x8x biurfication. PCIE-4.0 is only officially supported on X570 motherboards currently.

Core Peak Turbo Speed:

Maximum possible core clock speed is listed. The CPU will run its cores lower due to power/electrical and thermal limitations. This value is the maximum allowed speed if there is no limitation. Precision Boost Overdrive imposes a maximum current throughput and the 3700X will not be able to reach 4400 MHz on all 8 cores under heavy load without manual overclocking. Actual all-core clock speed on 3700X CPUs is around 4.1- 4.2GHz in my observation.

Maximum Main Memory

AM4 motherboards have only 2 DIMMs per Channel. 32GB DIMMS are thus required for maximum of 128GB of RAM.


Typical Maximum Power Use (including Turbo):

Based on my testing/observations

Normal Peak Voltage Range

Normal operating voltage under load based on my observations. The 3700X will use up to 1.5V for maximum peak frequency, but in low loads or very lightly threaded loads so the current is low. Otherwise sustained turbo for all core voltage is around 1.25-1.35V depending on cooling.

Misc.

This bit is for my personal opinion on this CPU

Sashleycat's Awesomeness Rating: Kardashev V

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